From September 10 to 12, 2025, the 26th China International Optoelectronic Exposition (CIOE) was successfully held in Shenzhen. The grand event gathered tens of thousands of professional visitors from around the world to explore the future of the industry.
China Science Photon chip (Haining) Technology Co., Ltd. (“CSPC”) made a joint appearance with its subsidiary CAVPIC (Haining) Optoelectronics Co., Ltd. CSPC showcased a variety of cutting-edge products and solutions based on high-performance silicon nitride materials, fully covering the two core fields of optical communication and optical sensing.
01
Site Review
CSPC’s dual booths — Booth 11C61 in the Information & Communication Exhibition and Booth 6B45 in the Intelligent Sensing Exhibition — attracted a large number of industrial customers, technical experts and partners for in-depth exchanges.
CSPC highlighted its 400G/800G/1.6T high-speed silicon photonic and TFLN heterogeneous integration chip products. Meanwhile, CSPC conducted an on-site demonstration of the 1.6T DR8 Tx-PIC in cooperation with KEYSIGHT, which made a brilliant debut at the CIOE.
-
SiPho Tx-PIC products
-
TFLN/SiN Heterogeneous IntegrationTx-PIC Series Products
3.2T DR8 TFLN/SiN Tx-PIC
-
Compatible design for one LD input drivers 4 and 8 optical lanes, with total on-chip loss 13dB and 16dB respectively
-
Modulator 3dB EO bandwidth > 110GHz with Vpi < 2.2V
1.6T DR8 TFLN/SiN Tx-PIC
-
Compatible design for one LD input drivers 4 and 8 optical lanes, with total on-chip los13dB and 16dB respectively
-
Modulator 3dB EO bandwidth > 67GHz with Vpi < 2.2V
1.6T 2*FR4 TFLN/SiN Tx-PIC
-
One LD input drives two optical lanes
-
Integrated passive CWDM4 MUXs, with loss < 1dB and spectral bandwidth > 13nm
Live Demo
At this exhibition, CSPC joined hands with KEYSIGHT to demonstrate the 1.6T DR8 Tx-PIC on site and build a 200G/lane silicon photonic high-frequency performance test platform. The company showcased the performance and test results of a number of self-developed silicon photonic chips, attracting visits and inquiries from internet companies, equipment manufacturers and optical module customers.
At present, CSPC’s 400G/800G/1.6T silicon photonic chips have entered mass production, and sample testing is available for customers. We welcome customers across the industry to communicate and consult with us.
Guoke Optical Core Joint KEYSIGHT Exhibits 1.6T DR8 Tx-PIC Live Demo
live demonstration of EVB eye diagram
Core technology advantages
During the exhibition, the CSPC team held in-depth discussions with experts from well-known enterprises worldwide on the application prospects of silicon photonics and TFLN heterogeneous integration technologies in next-generation 3.2T optical interconnects.
swipe to see more live pictures
11C61,6B45
Having long focused on the SiN heterogeneous integrated TFLN technology route, CSPC introduced its core technological advantages to visiting industry experts:
-
By fully leveraging the low-loss characteristics of SiN as an optical waveguide medium and the high-bandwidth performance of TFLN modulators, the company can meet the requirements of 400G/lane and higher-speed applications. The products also feature high linearity and low driving voltage.
-
Based on the existing mature silicon photonics process platform (CMOS process), the solution integrates multiple materials such as Si, SiN and Ge, and can integrate monitor photodiodes (MPD) on chip, featuring low cost and mass-producibility.
Many customers expressed strong intention to cooperate with CSPC on its technological breakthroughs in TFLN heterogeneous integration, with particular attention to the product performance in high bandwidth, low power consumption and mass-producibility. Some customers have initially proposed demands for sample testing and customized development.
CSPC highlighted its products including the SS-OCT precision measurement system and metasurface/metalens solutions. CAVPIC also attracted strong attention with its multi dimensional tactile perception technology and widely tunable narrow-linewidth swept source lasers.
-
SS-OCT Precision Measurement System
Featuring micrometer-level high resolution and millimeter-level deep imaging capability, this is a new-generation high-precision optical non-destructive testing equipment independently developed by our company and exhibited for the first time. The on-site demonstration showcased our self-developed OCT chip, and presented high-precision dynamic scanning results for application scenarios including power battery casings, aluminum alloy welding seams, and optical lenses. Its differentiated core advantages attracted in-depth inquiries and business negotiations from customers in related fields.
-
Metasurface / Metalens
Based on precise subwavelength modulation and the advantages of large scale semiconductor manufacturing, we have reduced the thickness of conventional millimeter scale lenses to the micrometer level, bringing technological innovation to the optical lens module industry. We exhibited our self-developed metasurface chips and their optical functions that can replace traditional lenses. We also dynamically demonstrated the point-cloud performance of LiDAR integrated with metalenses. These achievements attracted visits and recognition from leading enterprises in automotive, 3C, security and other fields.
-
Multi-dimensional Tactile Perception
FBG multi-dimensional tactile perception technology combines the high sensitivity, anti-interference capability and multi-parameter sensing characteristics of optical fibers to achieve multi-dimensional measurement of tactile signals. It is suitable for applications including robotics, prosthetics, medical surgery, home-based elderly care and other fields.
-
Widely Tunable Narrow Linewidth Swept-Source Laser
Based on a low-loss silicon nitride external cavity and a broadband gain chip, wavelength tuning across C, C+L, O bands is achieved while maintaining narrow linewidth and single-mode output. It is suitable for optical fiber sensing, optical communications, and scientific research applications.
02
Excellent Speech
During the exhibition, Dr. Zhu Yu, Co-CTO of CSPC and General Manager of Data Communication Business Unit, delivered a keynote speech entitled Development and Applications of Silicon Photonics Heterogeneous Integration Technology at the High-Performance Optoelectronic Integrated Chip Frontier Technology Forum.
The report introduced and analyzed the technical advantages brought by silicon photonics heterogeneous integration to the industry, as well as its future development trends and commercialization opportunities, from multiple perspectives including the market background, technical evolution, and commercialization progress of silicon photonics heterogeneous integration.
Dr. Zhu Yu pointed out that:
- The silicon photonics roadmap follows the law of doubling bandwidth per generation, and silicon photonics heterogeneous integration is expected to break through the bandwidth bottleneck.
- SOI + SiN + TFLN is one of the most competitive solutions to achieve high bandwidth, high modulation efficiency and low loss.
- The industrialization of silicon photonics heterogeneous integration must rely on mature CMOS platforms, while continuously developing advanced process platforms including bonding and TFLN lines, to realize the integration of multiple materials such as Si, SiN, Ge, TFLN and multi-layer metals.
03
About Us
Guoke Optical Core was established in April 2019. Based on a new generation of silicon optical material-silicon nitride, the company is committed to becoming the world's leading provider of silicon optical chip technology and overall solutions. In 2023, 1 million units of lidar products will be mass-produced and shipped, becoming the TOP3 supplier of global consumer lidar, laying the foundation for the industry. On the basis of preliminary achievements in the sensing field, the company has rapidly laid out the optical communication field. Based on the independently developed "silicon nitride +" technology platform and TFLN heterogeneous integration technology, the company has established two product systems of silicon light and TFLN heterogeneous integration, and successfully developed 400G/800G/1.6T silicon light and TFLN/SiN heterogeneous integration Tx-PIC products. At present, the total number of the company is 180 +, of which the doctor 15 +, research and development personnel accounted for more than 70%, the core backbone are from the industry's well-known optical chip, optical module company, the core chip research and development team deep in the field of silicon light for 15 + years, to provide customers with high-performance silicon light integrated chip solutions.
CIOE China Optical Expo provides an opportunity for Guoke Optical Core to communicate face-to-face with domestic and foreign customers. The exhibition not only demonstrated the company's technical strength, but also enhanced the opportunities for collaboration with the upstream and downstream of the industrial chain.
Looking to the future, Guoke optical core will continue to be guided by "committed to becoming the world's leading silicon optical chip technology and overall solution company", adhere to the innovation driven concept, and constantly launch more high-performance and high-quality products, so as to provide better solutions for the development of global silicon nitride silicon optical technology.
